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| MURS360BT3 Surface Mount Ultrafast Power Rectifiers Ideally suited for high voltage, high frequency rectification, or as free wheeling and protection diodes in surface mount applications where compact size and weight are critical to the system. http://onsemi.com Features * * * * * * * * * * * Small Compact Surface Mountable Package with J-Bend Leads Rectangular Package for Automated Handling High Temperature Glass Passivated Junction This is a Pb-Free Device ULTRAFAST RECTIFIERS 3 AMPERES 600 VOLTS Mechanical Characteristics Case: Epoxy, Molded Epoxy Meets UL 94 V-O @ 0.125 in Weight: 95 mg (approximately) Finish: All External Surfaces Corrosion Resistant and Terminal Leads are Readily Solderable Lead and Mounting Surface Temperature for Soldering Purposes: 260C Max. for 10 Seconds Polarity: Polarity Band Indicates Cathode Lead ESD Rating: Human Body Model (HBM) 3B Machine Model (MM) C SMB CASE 403A MARKING DIAGRAM AYWW B36BG G MAXIMUM RATINGS Rating Peak Repetitive Reverse Voltage Working Peak Reverse Voltage DC Blocking Voltage Average Rectified Forward Current Non- Repetitive Peak Surge Current (Surge applied at rated load conditions halfwave, single phase, 60 Hz) Operating Junction Temperature Symbol VRRM VRWM VR IF(AV) IFSM Value 600 Unit V B36B = Specific Device Code A = Assembly Location Y = Year WW = Work Week G = Pb-Free Package (Note: Microdot may be in either location) 3.0 @ TL = 105C 100 A A ORDERING INFORMATION TJ *65 to +175 C Device MURS360BT3G Package SMB (Pb-Free) Shipping 2500/Tape & Reel Stresses exceeding Maximum Ratings may damage the device. Maximum Ratings are stress ratings only. Functional operation above the Recommended Operating Conditions is not implied. Extended exposure to stresses above the Recommended Operating Conditions may affect device reliability. For information on tape and reel specifications, including part orientation and tape sizes, please refer to our Tape and Reel Packaging Specifications Brochure, BRD8011/D. (c) Semiconductor Components Industries, LLC, 2007 1 June, 2007 - Rev. 1 Publication Order Number: MURS360BT3/D MURS360BT3 THERMAL CHARACTERISTICS Characteristic Thermal Resistance, Junction-to-Lead (Note 1) Thermal Resistance, Junction-to-Ambient (Note 1) 1. Mounted with minimum recommended pad size, PC Board FR4. Symbol RqJL RqJA Value 14 71 Unit C/W ELECTRICAL CHARACTERISTICS Characteristic Maximum Instantaneous Forward Voltage (Note 2) (iF = 3.0 A, TJ = 25C) (iF = 3.0 A, TJ = 150C) Maximum Instantaneous Reverse Current (Note 2) (Rated DC Voltage, TJ = 25C) (Rated DC Voltage, TJ = 150C) Maximum Reverse Recovery Time (iF = 1.0 A, di/dt = 50 A/ms) (iF = 0.5 A, iR = 1.0 A, IR to 0.25 A) Maximum Forward Recovery Time (iF = 1.0 A, di/dt = 100 A/ms, Rec. to 1.0 V) 2. Pulse Test: Pulse Width = 300 ms, Duty Cycle v 2.0%. Symbol vF 0.83 iR 95 trr 75 50 tfr 50 ns 3.0 150 ns 1.25 1.05 mA Typ Max Unit V TYPICAL CHARACTERISTICS IF, INSTANTANEOUS FORWARD CURRENT (A) 10 150C 1 IF, INSTANTANEOUS FORWARD CURRENT (A) 10 150C 1 125C 25C 125C 25C 0.1 0.1 0.01 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 VF, INSTANTANEOUS FORWARD VOLTAGE (V) 0.01 0.3 0.4 0.5 0.6 0.7 0.8 0.9 1.0 1.1 1.2 1.3 1.4 VF, INSTANTANEOUS FORWARD VOLTAGE (V) Figure 1. Typical Forward Voltage Ir, REVERSE CURRENT (mA) 150C 0.01 125C 0.001 Ir, REVERSE CURRENT (mA) 0.1 1 Figure 2. Maximum Forward Voltage 0.1 150C 0.01 125C 0.001 0.0001 25C 0.00001 0.000001 0 100 200 300 400 500 600 Vr, REVERSE VOLTAGE (V) 0.0001 0.00001 0 25C 100 200 300 400 500 600 Vr, REVERSE VOLTAGE (V) Figure 3. Typical Reverse Current http://onsemi.com 2 Figure 4. Maximum Reverse Current MURS360BT3 TYPICAL CHARACTERISTICS 70 IF(AV), AVERAGE FORWARD CURRENT (A) 60 C, CAPACITANCE (pF) 50 40 30 20 10 0 0 20 40 60 80 100 Vr, REVERSE VOLTAGE (V) TJ = 25C f = 1 MHz 5 dc 4 Square 3 2 1 0 65 75 85 95 105 115 125 135 145 155 TC, CASE TEMPERATURE (C) Figure 5. Typical Capacitance IF(AV), AVERAGE FORWARD CURRENT (A) 3 RqJA = 71C/W dc 2 dc 1 Square Wave RqJA = 120C/W No Heatsink PF(AV), AVERAGE POWER DISSIPATION (W) 3 4 Figure 6. Current Derating, Lead TJ = 150C Square Wave dc 2 1 0 0 25 50 75 100 125 150 TA, AMBIENT TEMPERATURE (C) 0 0 1 2 3 4 IF(AV), AVERAGE FORWARD CURRENT (A) Figure 7. Current Derating, Ambient 4 Figure 8. Typical Forward Power Dissipation Square Wave PF(AV), AVERAGE POWER DISSIPATION (W) TJ = 150C dc 3 2 1 0 0 1 2 3 4 IF(AV), AVERAGE FORWARD CURRENT (A) Figure 9. Maximum Forward Power Dissipation http://onsemi.com 3 MURS360BT3 100 50% Duty Cycle 10 R(t) (C/W) 20% 10% 5% 2% 1 1% 0.1 Single Pulse 0.01 0.000001 0.00001 0.0001 0.001 0.01 0.1 PULSE TIME (s) 1 10 100 1000 Figure 10. Thermal Response, Junction-to-Ambient http://onsemi.com 4 MURS360BT3 PACKAGE DIMENSIONS SMB DO-214AA CASE 403A-03 ISSUE F HE E NOTES: 1. DIMENSIONING AND TOLERANCING PER ANSI Y14.5M, 1982. 2. CONTROLLING DIMENSION: INCH. 3. D DIMENSION SHALL BE MEASURED WITHIN DIMENSION P. MILLIMETERS NOM MAX 2.13 2.45 0.10 0.20 2.03 2.20 0.23 0.31 3.56 3.95 4.32 4.60 5.44 5.60 1.02 1.60 0.51 REF INCHES NOM 0.084 0.004 0.080 0.009 0.140 0.170 0.214 0.040 0.020 REF b D DIM A A1 b c D E HE L L1 MIN 1.90 0.05 1.96 0.15 3.30 4.06 5.21 0.76 MIN 0.075 0.002 0.077 0.006 0.130 0.160 0.205 0.030 MAX 0.096 0.008 0.087 0.012 0.156 0.181 0.220 0.063 A L L1 c A1 SOLDERING FOOTPRINT* 2.261 0.089 2.743 0.108 2.159 0.085 SCALE 8:1 mm inches *For additional information on our Pb-Free strategy and soldering details, please download the ON Semiconductor Soldering and Mounting Techniques Reference Manual, SOLDERRM/D. ON Semiconductor and are registered trademarks of Semiconductor Components Industries, LLC (SCILLC). SCILLC reserves the right to make changes without further notice to any products herein. SCILLC makes no warranty, representation or guarantee regarding the suitability of its products for any particular purpose, nor does SCILLC assume any liability arising out of the application or use of any product or circuit, and specifically disclaims any and all liability, including without limitation special, consequential or incidental damages. "Typical" parameters which may be provided in SCILLC data sheets and/or specifications can and do vary in different applications and actual performance may vary over time. All operating parameters, including "Typicals" must be validated for each customer application by customer's technical experts. SCILLC does not convey any license under its patent rights nor the rights of others. SCILLC products are not designed, intended, or authorized for use as components in systems intended for surgical implant into the body, or other applications intended to support or sustain life, or for any other application in which the failure of the SCILLC product could create a situation where personal injury or death may occur. Should Buyer purchase or use SCILLC products for any such unintended or unauthorized application, Buyer shall indemnify and hold SCILLC and its officers, employees, subsidiaries, affiliates, and distributors harmless against all claims, costs, damages, and expenses, and reasonable attorney fees arising out of, directly or indirectly, any claim of personal injury or death associated with such unintended or unauthorized use, even if such claim alleges that SCILLC was negligent regarding the design or manufacture of the part. SCILLC is an Equal Opportunity/Affirmative Action Employer. This literature is subject to all applicable copyright laws and is not for resale in any manner. PUBLICATION ORDERING INFORMATION LITERATURE FULFILLMENT: Literature Distribution Center for ON Semiconductor P.O. Box 5163, Denver, Colorado 80217 USA Phone: 303-675-2175 or 800-344-3860 Toll Free USA/Canada Fax: 303-675-2176 or 800-344-3867 Toll Free USA/Canada Email: orderlit@onsemi.com N. American Technical Support: 800-282-9855 Toll Free USA/Canada Europe, Middle East and Africa Technical Support: Phone: 421 33 790 2910 Japan Customer Focus Center Phone: 81-3-5773-3850 ON Semiconductor Website: www.onsemi.com Order Literature: http://www.onsemi.com/orderlit For additional information, please contact your local Sales Representative http://onsemi.com 5 MURS360BT3/D |
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